Products & Services

Bond-Prep is available in a range of formats to suit all application requirements.

 The ‘400’ strength is manufactured as a low viscosity solution designed for PCB etching, which will penetrate, wet-out and etch the smallest vias.

 The higher viscosity ‘500’ solution is more robust and is Intended for ‘open-air’, piece-part etching.

APC also offer ‘etching kits’ where all the chemistry for the Job is in one box. The kits come with colour coded Post-Etch Rinse solutions to deactivate and pH neutralise parts after immersion in Bond-Prep.

Available in 900ml, 450ml & 225ml kits, these are a popular choice for small-scale, piece-part etching such as small PTFE parts or PTFE insulated wire ends.

APC has the only independent contract etching facility in Ireland with a process line specifically designed for PTFE printed circuit boards.

APC (Scotland) Ltd, Kilfinny, Adare, Co. Limerick, V94 WV50, Ireland

Phone: +353 (0)61 395 335

Phone: +353 (0)61 395 335

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